About the role#
As a SoC Design Engineer Intern, you will join the Heterogeneous Integration Group. You will contribute to the design, development, and integration of HBM SoC logic die. You will work with architecture, verification, physical design, firmware, and product teams to implement SoC solutions that meet power, performance, and area targets.
What you'll do#
- Design and implement RTL for SoC-level blocks and subsystems.
- Integrate internal and third-party IP such as controllers, NOC, and interfaces.
- Translate architectural specifications into RTL implementations.
- Participate in SoC-level integration tasks including clocking, reset, and power intent.
- Assist with pre-silicon validation and post-silicon bring-up.
- Contribute to design documentation and block specifications.
- Collaborate with product engineering and manufacturing teams to ensure manufacturable builds.
What you'll need#
- Current pursuit of a Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related field.
- Availability for a 6-month internship and a graduation date no earlier than December 2027.
- Proficiency in SystemVerilog or Verilog.
- Familiarity with SoC integration methodologies and EDA tools from Cadence, Synopsys, or Siemens.
- Experience with the RTL-to-GDS flow, including synthesis and static timing analysis.
- Programming or scripting skills in Python, TCL, Perl, or shell scripting.
Location & details#
- Location: Folsom, California.
- Modality: On-site.
- Compensation: $38.84 - $50.24 per hour.
- Status: Full-time internship.
About Micron Technology
Micron Technology produces memory and storage solutions including DRAM, NAND, and NOR products. The company operates as a public organization with over 43,000 employees. Founded in 1978, it maintains its headquarters in Boise, Idaho. Micron serves various markets ranging from data centers to mobile devices.
How to get in at Micron Technology
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