Model Correlation & SI Intern - Ph. D Degree

About the role#

This is a full-time, paid internship opportunity for a Master or Ph.D. student. You will work with industry-standard package designs and measurement instruments while addressing design constraints and trade-offs within the semiconductor industry.

What you'll do#

• Work with industry-standard package designs and EDA tools including HFSS and ADS.
• Analyze design constraints and trade-offs relevant to industry requirements.
• Utilize best-in-class package designs and measurement instruments to support high-speed interface projects.
• Present data and technical ideas to a diverse audience.

What you'll need#

• Current enrollment in a Master or Ph.D. degree program in Electrical Engineering, Computer Engineering, or Computer Science.
• Understanding of semiconductor packaging or integration technology, specifically signal and power integrity, mechanical processes, or assembly processes.
• Experience with lab measurements using VNA and calibration kits.
• Proficiency in using Python for test scripts.
• Familiarity with Cadence tools such as APD or PCB Editor.

Location & details#

• Location: Ottawa, Ontario, Canada.
• Modality: On-site.
• Term: Rolling.
• Compensation: 32 - 43 CAD per hour.
• Note: This position may require access to technology subject to U.S. export control laws, and candidates must be eligible to access export-controlled information.