About the role#
This is a full-time, paid internship opportunity for a Master or Ph.D. student. You will work with industry-standard package designs and measurement instruments while addressing design constraints and trade-offs within the semiconductor industry.
What you'll do#
- Work with industry-standard package designs and EDA tools including HFSS and ADS.
- Analyze design constraints and trade-offs relevant to industry requirements.
- Utilize best-in-class package designs and measurement instruments to support high-speed interface projects.
- Present data and technical ideas to a diverse audience.
What you'll need#
- Current enrollment in a Master or Ph.D. degree program in Electrical Engineering, Computer Engineering, or Computer Science.
- Understanding of semiconductor packaging or integration technology, specifically signal and power integrity, mechanical processes, or assembly processes.
- Experience with lab measurements using VNA and calibration kits.
- Proficiency in using Python for test scripts.
- Familiarity with Cadence tools such as APD or PCB Editor.
Location & details#
- Location: Ottawa, Ontario, Canada.
- Modality: On-site.
- Term: Rolling.
- Compensation: 32 - 43 CAD per hour.
- Note: This position may require access to technology subject to U.S. export control laws, and candidates must be eligible to access export-controlled information.
