Packaging Engineering Intern

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    Texas Instruments

    10,001+ employeesFounded 1930Dallas, TXSemiconductor Manufacturing
    Actively hiringPaidrollingSemiconductor Manufacturing
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    Best applied by Sep 17

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    About the role#

    As a Packaging Engineering Intern, you will work on the design, development, and analysis of semiconductor packaging technologies. You will join cross-functional teams to create internal and external solutions for various package types, including Wirebond, Flip Chip, Modules, and SIPs. This role involves working across different organizations to help advance packaging technologies for analog and embedded processing products.

    What you'll do#

    • Interface with multiple work areas to support packaging design and analysis.
    • Participate in team projects at various stages of product readiness.
    • Advance packaging capabilities through material, mechanical, thermal, and electrical characterization.

    What you'll need#

    • Current enrollment in a Bachelors degree program for Mechanical Engineering, Materials Science, Chemical Engineering, Physics, or Electrical Engineering.
    • A cumulative GPA of 3.0/4.0 or higher.
    • Strong written and verbal communication skills.
    • Ability to collaborate effectively within a team environment.
    • Knowledge of semiconductor packaging processes, assembly, reliability, materials, and characterization is preferred.

    Location & details#

    • Location: Dallas, Texas, USA.
    • Work modality: On-site.
    • This is a full-time, paid internship with a rolling term.
    • Texas Instruments does not provide visa sponsorship for this position.

    About Texas Instruments

    Texas Instruments is a public semiconductor company founded in 1930. Based in Dallas, Texas, it designs and manufactures analog and embedded processing chips. The company serves clients in the industrial, automotive, and personal electronics sectors. It operates with over 33,000 employees globally.

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