Silicon Photonics Advanced Packaging Intern

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    GlobalFoundries

    We shape what's essential.

    10,001+ employeesFounded 2009Malta, NYSemiconductor Manufacturing
    Actively hiringPaidSummer 2027Semiconductor Manufacturing
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    Best applied by Sep 3

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    About the role#

    This summer 2027 internship focuses on the development of electro-optical transceivers using the Photonix platform and advanced 2.5D and 3D co-packaged optics. You will work on thermal, mechanical, electrical, and optical chip-package co-design. The role involves module performance, reliability, packaging design, materials selection, and advanced chiplet integration.

    What you'll do#

    • Contribute to packaging design rules, product requirements, and manufacturing processes.
    • Join cross-functional design reviews to resolve technical, manufacturability, reliability, and yield concerns.
    • Develop and apply simulation models to evaluate package performance, manufacturability, cost, and quality.
    • Contribute to qualification robustness and continuous improvement plans.
    • Follow all safety, health, and security requirements.

    What you'll need#

    • Currently pursuing a Bachelor’s or Master’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, Photonics, Optical Engineering, Packaging Engineering, or a related field.
    • A minimum overall GPA of 3.0.
    • Fluency in English, both written and verbal.
    • Ability to work at least 40 hours per week.

    Location & details#

    • Location: Malta, New York, USA.
    • Term: Summer 2027.
    • Modality: On-site.
    • Status: Full-time and paid.

    About GlobalFoundries

    GlobalFoundries manufactures semiconductors for various industries including automotive, aerospace, and data centers. The company operates manufacturing facilities across the United States, Europe, and Asia. It was founded in 2009 and currently functions as a public company. The organization employs over 10,000 people.

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