About the role#
This is a summer 2027 internship based in Yorktown Heights, New York. You will work within the IBM Research team to develop integrated circuits using deep sub-micron CMOS technologies. The work focuses on circuit designs for AI acceleration, high-speed communications, and chiplet-based integration.
What you'll do#
- Collaborate on architecture and system-level development, including trade-off analysis using simulations or measured data.
- Design and synthesize digital or mixed-signal circuit building blocks to meet specific requirements.
- Run co-simulation and verification for circuits and sub-systems.
- Support physical design, synthesis, and post-layout verification.
- Document your design concepts, simulation methods, and verification results.
What you'll need#
- Current pursuit of a degree in Computer Engineering or Electrical Engineering.
- Experience with industry-standard IC-development tools like Cadence.
- Practical experience with deep sub-micron CMOS technologies.
- A history of completing complex mixed-signal or digital IC designs.
- Knowledge of AI-accelerator architectures and chiplet-based system implementation.
- Familiarity with standard-cell digital design, custom digital design, or mixed-signal design for high-speed communications.
- Proficiency in Python and experience with hardware-software co-design.
- Ability to clearly communicate technical ideas.
Location & details#
- Location: Yorktown Heights, New York, United States.
- Modality: On-site.
- Duration: Summer 2027.
- Employment: Full-time paid internship.
- Sponsorship: Not available.
About IBM
IBM provides IT services and consulting to a global client base. The company develops technology solutions across areas such as cloud computing, security, analytics, and infrastructure. It operates as a public organization with more than 10,001 employees. The corporate headquarters are located in Armonk, New York.
How to get in at IBM
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