About the role#
The HBM Physical Design team builds High Bandwidth Memory SoC and base die designs for AI, high-performance computing, and data centers. As a Physical Design Intern, you will work with experienced engineers to support the implementation of these advanced designs. You will gain hands-on experience with physical design methodologies, timing analysis, and signoff flows while contributing to memory products.
What you'll do#
- Support the physical implementation of SoC design blocks, including floorplanning, placement, clock tree synthesis, routing, and physical optimization.
- Analyze timing, power, area, congestion, and physical verification results to find design improvements.
- Assist with static timing analysis, timing closure, and debugging across multiple operating modes and process corners.
- Develop and enhance automation tools, scripts, reports, and workflows using Python, Tcl, shell scripting, and AI-assisted solutions.
- Collaborate with multi-functional engineering teams to document results, participate in design reviews, and present technical findings.
What you'll need#
- Currently pursuing a Master's degree in Electrical Engineering, Computer Engineering, or a related technical field.
- 0-2 years of relevant experience through internships, research, coursework, or academic projects in ASIC design, VLSI, digital IC design, computer architecture, or physical design.
- Knowledge of ASIC design flow concepts like synthesis, place-and-route, static timing analysis, and physical verification.
- Understanding of timing fundamentals, including setup/hold analysis, clock skew, timing constraints, and critical path analysis.
- Proficiency with programming or scripting languages such as Python, Tcl, Perl, or Shell.
- Familiarity with AI-enabled tools and large language models like Copilot or Claude.
- Experience or interest in RTL-to-GDSII implementation, industry-standard EDA tools, multi-mode timing analysis, and memory-centric SoCs.
- Strong analytical, problem-solving, communication, and teamwork skills.
Location & details#
- Location: Folsom, California
- Employment Type: Full-time
- Term: Rolling
- Paid internship: Yes
- Sponsorship: Not available
About Micron Technology
Micron Technology produces memory and storage solutions including DRAM, NAND, and NOR products. The company operates as a public organization with over 43,000 employees. Founded in 1978, it maintains its headquarters in Boise, Idaho. Micron serves various markets ranging from data centers to mobile devices.
How to get in at Micron Technology
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