Hardware Intern

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    IBM

    10,001+ employeesArmonk, New York, NYIT Services and IT Consulting
    Actively hiringPaidSummer 2027IT Services and IT Consulting
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    Best applied by Oct 3

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    About the role#

    This Hardware Intern position at IBM Research focuses on advanced bonding and reflow techniques. You will study how different package constructions interact with these techniques and gain exposure to packaging analysis methods. This role supports high-performance computing projects.

    What you'll do#

    • Study advanced bonding and reflow techniques.
    • Examine the effects of various package constructions.
    • Assess solder joints after the soldering process.
    • Collaborate with team members on specific projects.
    • Summarize your analytical results and draw conclusions.

    What you'll need#

    • Current studies in Physics, Microelectronics, Electrical Engineering, or a related field.
    • Proficiency in SMT soldering processes.
    • Ability to work effectively within a team.
    • Analytical skills for evaluating solder joint results.
    • An interest in learning new skills and exploring ideas.
    • Advanced studies in Microelectronics, EE, or Physics are preferred.
    • Knowledge of SMT assembly, solder joint evaluation, and solder alloy composition is a plus.

    Location & details#

    • Location: Yorktown Heights, New York, United States.
    • Modality: On-site.
    • Term: Summer 2027.
    • Employment: Full-time paid internship.

    About IBM

    IBM provides IT services and consulting to a global client base. The company develops technology solutions across areas such as cloud computing, security, analytics, and infrastructure. It operates as a public organization with more than 10,001 employees. The corporate headquarters are located in Armonk, New York.

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