Hardware and Systems Developer Intern

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    IBM

    10,001+ employeesArmonk, New York, NYIT Services and IT Consulting
    Actively hiringPaidrollingIT Services and IT Consulting
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    About the role#

    IBM is looking for interns to join the Infrastructure and Technology team. You will work on the compute platforms that power AI, cloud, and enterprise technologies. This role involves hands-on work in design, prototyping, testing, and process development across our high-performance systems portfolio. You will collaborate with teams across mechanical, electrical, computer, materials, and firmware engineering.

    What you'll do#

    • Collaborate across disciplines to design, model, and validate next-generation hardware.
    • Support mechanical, thermal, electrical, optical, and logic design using CAD, EDA, and simulation tools.
    • Participate in PCB layout, power and signal integrity, circuit design, and system bring-up.
    • Conduct experiments, analyze data, and contribute to reliability, process, and materials development projects.
    • Write scripts and automation tools using Python, C/C++, or Bash to support testing and validation.
    • Work in focus areas including mechanical and thermal design, electrical and logic design, optics and photonics, or materials and process engineering.

    What you'll need#

    • Current B.S. or M.S. student in Mechanical, Electrical, Materials, Chemical, Industrial, or related engineering disciplines.
    • Strong academic background with an interest in hardware design, optics, logic, process, or materials engineering.
    • Experience with CAD tools such as SolidWorks, AutoCAD, Allegro, or Cadence.
    • Experience with simulation tools like CFD, FEM, or HFSS.
    • Programming experience with Python, C/C++, or Bash for automation or data analysis.
    • Hands-on experience with lab tools including LabVIEW, MATLAB, oscilloscopes, thermal chambers, or optical test equipment.
    • Familiarity with design of experiments or project management in a research or lab environment.
    • Experience in signal or power integrity modeling, optical systems, logic design, or materials process engineering.
    • M.S. or Ph.D. students with a research focus in electrical packaging, photonics, signal integrity, or thermal design are encouraged to apply.

    Location & details#

    • Location: New York, New York, United States.
    • Work Modality: Hybrid.
    • Employment Type: Full-time internship.
    • Term: Rolling.
    • Compensation: Paid internship.

    About IBM

    IBM provides IT services and consulting to a global client base. The company develops technology solutions across areas such as cloud computing, security, analytics, and infrastructure. It operates as a public organization with more than 10,001 employees. The corporate headquarters are located in Armonk, New York.

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