About the role#
AMD is hiring an undergraduate intern for the ASIC Package Engineering team for the Summer 2027 term. This is a full-time, paid position requiring on-site work in San Jose or Santa Clara, California. You will work alongside engineers to develop and implement advanced packaging technologies.
What you'll do#
- Support Package Design and Package Development Engineers in prioritizing and optimizing new projects.
- Complete substrate, interposer, and bump designs for products, test vehicles, and probe card substrates.
- Manage projects focused on design verification to ensure performance, quality, and efficiency.
- Analyze yield and defect metrics to improve design performance.
- Evaluate and benchmark packaging materials while interacting with partners to achieve cost-efficient designs.
What you'll need#
- Current enrollment in a US-based university pursuing a Bachelor's degree.
- Major in Electrical Engineering, Computer Engineering, Mechanical Engineering, Chemical Engineering, Industrial Engineering, or a related field.
- Knowledge of transmission lines and electric circuits.
- Experience with package, silicon, or PCB design software.
- Familiarity with scripting languages such as Perl, Python, or SQL.
Location & details#
- Locations: San Jose, CA or Santa Clara, CA.
- Work Modality: On-site.
- Employment Type: Full-time (40 hours per week).
- Visa Sponsorship: Not available.
About AMD
AMD designs processors and graphic cards for computers, data centers, and gaming systems. The company operates in the semiconductor manufacturing sector. It was founded in 1969 and maintains its headquarters in Santa Clara, California. The organization employs more than 10,000 people.
How to get in at AMD
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