About the role#
IBM Research is looking for a hardware intern to join the Infrastructure and Technology team for the Summer 2027 term. This is a full-time, on-site position based in Yorktown Heights, New York.
What you'll do#
- Use laser assisted bonding (LAB) and laser assisted reflow (LAR) to explore new advanced soldering techniques.
- Test solder constellations in different package variations to evaluate warpage, solder joint quality, and bonding strength.
- Run tests across a wide temperature range.
What you'll need#
- Current studies in Electrical Engineering, Physics, Mechanical Engineering, or a related discipline.
- Proficiency in SMT assembly processes and experience with PCB or laminate design and stackups.
- Ability to define experiments and evaluate results effectively.
- Interest in working with new tools and innovative methods.
- Advanced academic standing in your field is preferred.
- Experience with laser soldering and detailed knowledge of soldering alloys.
- Knowledge of modeling for mechanical warpage and in-package stress.
Location & details#
- Location: Yorktown Heights, New York, United States.
- Modality: On-site.
- Term: Summer 2027.
- Compensation: This is a paid internship.
- Sponsorship: Visa sponsorship is not provided for this role.
About IBM
IBM provides IT services and consulting to a global client base. The company develops technology solutions across areas such as cloud computing, security, analytics, and infrastructure. It operates as a public organization with more than 10,001 employees. The corporate headquarters are located in Armonk, New York.
How to get in at IBM
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