Hardware intern: advanced packaging

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    IBM

    10,001+ employeesArmonk, New York, NYIT Services and IT Consulting
    Actively hiringPaidSummer 2027IT Services and IT Consulting
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    About the role#

    IBM Research is looking for a hardware intern to join the Infrastructure and Technology team for the Summer 2027 term. This is a full-time, on-site position based in Yorktown Heights, New York.

    What you'll do#

    • Use laser assisted bonding (LAB) and laser assisted reflow (LAR) to explore new advanced soldering techniques.
    • Test solder constellations in different package variations to evaluate warpage, solder joint quality, and bonding strength.
    • Run tests across a wide temperature range.

    What you'll need#

    • Current studies in Electrical Engineering, Physics, Mechanical Engineering, or a related discipline.
    • Proficiency in SMT assembly processes and experience with PCB or laminate design and stackups.
    • Ability to define experiments and evaluate results effectively.
    • Interest in working with new tools and innovative methods.
    • Advanced academic standing in your field is preferred.
    • Experience with laser soldering and detailed knowledge of soldering alloys.
    • Knowledge of modeling for mechanical warpage and in-package stress.

    Location & details#

    • Location: Yorktown Heights, New York, United States.
    • Modality: On-site.
    • Term: Summer 2027.
    • Compensation: This is a paid internship.
    • Sponsorship: Visa sponsorship is not provided for this role.

    About IBM

    IBM provides IT services and consulting to a global client base. The company develops technology solutions across areas such as cloud computing, security, analytics, and infrastructure. It operates as a public organization with more than 10,001 employees. The corporate headquarters are located in Armonk, New York.

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