Hardware Developer Engineer Intern (Mechanical)

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    IBM

    10,001+ employeesArmonk, New York, NYIT Services and IT Consulting
    Actively hiringPaidSummer 2027IT Services and IT Consulting
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    Best applied by Oct 23

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    About the role#

    As a Mechanical Engineering intern, you will help design and build the hardware platforms that power advanced computing and quantum systems. You will work within a multidisciplinary team to develop mechanical structures and technologies for infrastructure, including IBM zSystems, Power Systems, and Storage. This role covers the full hardware lifecycle, from concept development and modeling to prototype evaluation and product release.

    What you'll do#

    • Design and develop components, assemblies, and system-level structures.
    • Perform thermal design, analysis, and testing, including heat transfer modeling, airflow optimization, and cooling solutions.
    • Conduct structural and vibration analysis, materials selection, and reliability engineering.
    • Run finite element modeling for mechanical, thermal, or multiphysics simulations.
    • Work on microelectronics and system-level packaging, including the integration of processors, memory, power delivery, and high-density interconnects.
    • Optimize designs for manufacturability and assembly, including tolerance analysis and DFMA principles.
    • Collaborate across electrical, firmware, and product engineering teams.
    • Provide field and customer engineering support, including root cause analysis of mechanical or environmental issues.
    • Develop product quality, reliability, and specifications.

    What you'll need#

    • Currently pursuing a Bachelor's Degree in Mechanical Engineering or a related field.
    • Prior project or internship experience in computer hardware or testing.
    • Strong verbal and written communication skills.
    • A focus on growth, teamwork, and results.
    • Master's Degree is preferred.
    • At least three months of experience in computer or electrical engineering, specifically with cable assemblies, harnesses, and interconnectivity, is preferred.

    Location & details#

    • Location: San Jose, California.
    • Term: Summer 2027.
    • Work Modality: Hybrid.
    • Employment: Full-time internship.
    • Compensation: This is a paid position.
    Relevant fieldsMechanical Engineering

    About IBM

    IBM provides IT services and consulting to a global client base. The company develops technology solutions across areas such as cloud computing, security, analytics, and infrastructure. It operates as a public organization with more than 10,001 employees. The corporate headquarters are located in Armonk, New York.

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