About the role#
This is a paid, full-time, on-site internship based in Middletown, Pennsylvania. The role focuses on contact physics, tribology, and plating processes within an engineering environment.
What you'll do#
- Conduct experiments in a laboratory setting.
- Assist in the development of tribology testing protocols.
- Analyze and document experimental results.
- Collaborate with engineering teams on project development.
- Maintain laboratory equipment and adhere to safety protocols.
What you'll need#
- Current enrollment in Physics, Mechanical Engineering, Chemical Engineering, or Industrial Engineering.
- Understanding of physics and engineering principles.
- Knowledge of tribology and plating processes.
- Strong analytical skills and attention to detail.
- Ability to work collaboratively within a team.
Location & details#
- Location: Middletown, PA.
- Work Modality: On-site.
- Employment Type: Full-time internship.
- Sponsorship: Not available.
About TE Connectivity
TE Connectivity produces connectivity and sensor solutions for global markets. The company supports sectors including transportation, energy, and automated factories. It operates in approximately 130 countries and employs over 10,000 people. Its products facilitate the distribution of power, signal, and data for various industrial technologies.
How to get in at TE Connectivity
Securing an internship at TE Connectivity requires timing and direct communication. Because the company receives a high volume of interest, Intern Insider sends an instant alert the moment a role matching your target is published anywhere. This allows you to apply among the first, as early applicants are often reviewed before the candidate pool grows too large. Beyond timing your application, you should try to connect with the people managing the hiring process. Intern Insider surfaces the recruiters behind the company's roles so you can reach out directly to ask about the position or a referral. Engaging with these individuals can materially improve your response rates compared to submitting a cold application.
