Packaging Engineer Intern

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    MACOM

    Partners from RF to Light

    1,001-5,000 employeesFounded 1950Lowell, MASemiconductors
    Actively hiringPaidrollingSemiconductors
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    Best applied by Oct 8

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    About the role#

    MACOM is hiring a Packaging Engineer Intern to support our team in Milpitas. You will work alongside our engineers to package bumped ICs, ensuring they meet customer, reliability, and manufacturing requirements. This is a full-time, paid internship.

    What you'll do#

    • Assist the Packaging Engineer with daily tasks.
    • Create bump mask and substrate designs.
    • Conduct thermal analysis.
    • Perform design reviews to verify adherence to manufacturing guidelines.
    • Complete an individual project with specific goals.
    • Present your project outcomes at a poster session.

    What you'll need#

    • Enrollment as a student in Mechanical or Thermal Engineering.
    • Working knowledge of AutoCAD or Solidworks.
    • Experience with FEA tools such as ANSYS, Icepak, or Flotherm.

    Location & details#

    • Location: Milpitas, California.
    • Modality: On-site.
    • Compensation: $20 to $47 per hour.
    • Term: Rolling.
    Relevant fieldsMechanical Engineering

    About MACOM

    MACOM designs and manufactures semiconductor products for the telecommunications, data center, industrial, and aerospace markets. Founded in 1950, the company produces RF, microwave, and millimeter wave solutions along with optoelectronics. It maintains a global presence with its headquarters in Lowell, Massachusetts, and multiple facilities across North America, Europe, and Asia. The company employs between 1,001 and 5,000 people.

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