Memory Core Design Engineering Intern

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    Solidigm

    1,001-5,000 employeesFounded 2021Rancho Cordova, CaliforniaComputer Hardware Manufacturing
    Actively hiringPaidSummer 2027Computer Hardware Manufacturing
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    Best applied by Sep 14

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    About the role#

    This internship offers high autonomy and ownership. You will work alongside engineers and scientists to build floating gate memory technology used in AI infrastructure. Your daily tasks will range from focused circuit design to collaborating with teams across the company to develop features for customers.

    What you'll do#

    • Design innovative circuits including analog, semi-custom, and mixed-signal components for 3DNAND flash memory core.
    • Collaborate with cross-functional teams to improve power, performance, area, and reliability through transistor-level analysis.
    • Drive the architecture, design, and physical implementation of memory core circuits.
    • Develop memory cell arrays, sense amplifiers, decoders, and word line or bit line drivers.

    What you'll need#

    • You must be currently pursuing a Masters or Ph.D. degree in Electrical or Electronic Engineering.
    • You must be in good academic standing.

    Location & details#

    • Location: Rancho Cordova, California.
    • Term: Summer 2027.
    • Modality: On-site.
    • Employment type: Full-time.
    • This position is paid.
    Relevant fieldsElectrical Engineering

    About Solidigm

    Solidigm manufactures NAND flash memory products. The company formed in 2021 as a subsidiary of SK hynix, following the acquisition of memory assets from Intel. It maintains headquarters in Rancho Cordova, California. The organization employs between 1,001 and 5,000 people and operates across multiple international locations.

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