Process Engineering Intern - Fall

About the role#

Atomic Semi is seeking Process Engineering Interns for the Fall 2027 term to assist in rebuilding the chip fabrication process from the ground up. This is a hands-on role involving the design and execution of new semiconductor and thin-film fabrication methods. You will work with autonomy to contribute to novel R&D processes and influence tool design in a startup environment.

What you'll do#

• Design and run experiments in collaboration with senior process engineers.
• Review academic papers and technical literature to inform experimental design, whiteboard ideas, and iterate quickly.
• Operate a range of semiconductor tools, including deposition, etch, lithography, and metrology systems.
• Develop, transfer, and optimize process recipes across platforms to improve consistency, yield, and throughput.
• Analyze process data, troubleshoot recipe or equipment issues, and document findings and results for the team.

What you'll need#

• Pursuing a Bachelor’s Degree or higher in Electrical, Mechanical, Chemical, or Computer Engineering, or Physics.
• Strong foundation in theoretical semiconductor knowledge, including devices and fabrication.
• Hands-on experience with wafer fabrication tools, such as etch, deposition, and patterning, and metrology tools like AFM, SEM, and thin film measurement.
• Experience with recipe development and optimization for thin film deposition, dry etch, or lithography.
• Ability to learn quickly and troubleshoot technical problems.

Location & details#

• Location: San Francisco, California.
• Term: Fall 2027.
• Modality: On-site.
• Compensation: Paid position with a salary range equivalent to $105,000–$126,000 annualized.
• Benefits: Includes a housing stipend, medical, dental, and vision insurance, 401(k), paid time off, and visa sponsorship.