Packaging Engineering Intern - Fall

About the role#

Atomic Semi is seeking Packaging Engineering Interns for the Fall 2027 term. This is a hands-on engineering position focused on end-to-end process development and integration for semiconductor packaging. You will participate in research and development, including mechanical prototyping, experiment design, and data analysis. The role emphasizes building and testing systems in short cycles, providing exposure to fabrication processes such as 3D printing, metal plating, lasering, and metrology.

What you'll do#

• Design and iterate on machines and subsystems for semiconductor packaging fabrication, including laser ablation machines, reflow ovens, and automated metal plating facilities.
• Integrate mechanical, electrical, and optical components in system assembly, covering tasks like wiring, optics alignment, and electronics.
• Collaborate with cross-functional teams to continuously improve fabrication processes and equipment.
• Perform hands-on package and wafer processing, including 3D printing, metal plating, lithography, and metrology.

What you'll need#

• Currently pursuing a Bachelor’s Degree or higher in Mechanical, Electrical, or Industrial Engineering.
• At least 1-2 hands-on wet lab or lab-adjacent experiences, preferably in metal plating or device fabrication.
• A strong foundation in mechanical engineering, including proficiency in Solidworks or Onshape and materials selection.
• Proven hands-on prototyping experience and the ability to move through design cycles quickly.

Location & details#

• Location: San Francisco, California.
• Term: Fall 2027.
• Modality: On-site.
• Compensation: Paid internship with a housing stipend.
• Employment: Full-time.
• Sponsorship: Available.