About the role#
The 3D DRAM Metals team develops next-generation memory technologies. This internship offers hands-on experience in semiconductor process development. You will work alongside experienced engineers on projects that impact future product development. The role concludes with a presentation of your findings to engineering leadership.
What you'll do#
- Develop and optimize semiconductor processes to meet physical and electrical performance requirements.
- Partner with multi-functional process and equipment teams to identify and implement improvements.
- Perform root-cause and failure-mode analysis to address manufacturing challenges.
- Analyze statistical data from pilot-scale lines and share findings through reports and presentations.
- Apply AI-assisted tools to improve data analysis, process optimization, and productivity.
What you'll need#
- Current enrollment in a Ph.D. program in Materials Science, Chemical Engineering, Chemistry, Physics, or a related technical field.
- Graduation date no earlier than September 2027.
- Experience with experimental design, data analysis, and interpreting technical results.
- Strong problem-solving skills, including the ability to apply root-cause or model-based approaches.
- Ability to manage multiple priorities independently.
- Excellent verbal and written communication skills for presenting to diverse audiences.
- Preferred: Knowledge of statistics, programming experience (Python, MATLAB, or R), and familiarity with semiconductor manufacturing.
Location & details#
- Location: Boise, Idaho.
- Modality: On-site.
- Employment: Full-time internship.
- Compensation: Paid position.
How to get in at Micron Technology
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