About the role#
IBM Research is hiring interns to join our Silicon Technology Research and Development team. You will work on hardware design and applications, covering everything from chip architecture and fabrication to testing and advanced packaging. This is a paid, full-time, on-site internship with a rolling start date.
What you'll do#
- Conduct research on new technologies and solutions.
- Apply your research skills to hardware design, chip architecture, fabrication, and packaging.
- Publish your findings in top-tier journals and conferences.
- Contribute to the commercialization of new research assets.
What you'll need#
- A background in Physics, Chemistry, or engineering fields including Computer, Electrical, Mechanical, Chemical, Aerospace, or Biomedical.
- A strong research record shown through projects or publications in semiconductor technology or materials science.
- Expertise in at least one of these areas: semiconductor or memory device fabrication, lithography, plasma etch, film deposition, epitaxial growth, wet chemical processes, device physics, chip packaging, thermal management, polymer materials, computational materials science, computational optics, device simulation, or semiconductor characterization.
- Demonstrated communication skills and the ability to work both independently and within a team.
- Prior publication history or previous internship experience.
- Technical leadership potential.
Location & details#
- Location: United States (multiple cities).
- Modality: On-site.
- Sponsorship: Not available.
About IBM
IBM provides IT services and consulting to a global client base. The company develops technology solutions across areas such as cloud computing, security, analytics, and infrastructure. It operates as a public organization with more than 10,001 employees. The corporate headquarters are located in Armonk, New York.
How to get in at IBM
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