About the role#
This internship focuses on advanced packaging research. You will work with laser assisted bonding (LAB) and laser assisted reflow (LAR) to investigate new soldering techniques. The role involves hands-on testing and data collection to support hardware development.
What you'll do#
- Use LAB and LAR methods to explore soldering techniques.
- Test solder constellations across various package types.
- Evaluate solder joint quality, bonding strength, and package warpage.
- Conduct testing across a wide temperature range.
What you'll need#
- Current studies in Electrical Engineering, Physics, Mechanical Engineering, or a related field.
- Proficiency in SMT assembly processes.
- Experience with PCB or laminate design and stackups.
- Ability to define experiments and evaluate results.
- Interest in working with new tools and innovative processes.
- Knowledge of soldering alloys, laser soldering, and mechanical warpage modeling is preferred.
Location & details#
- This is an on-site role based in Yorktown Heights, New York.
- The position is a full-time, paid internship with a rolling term.
About IBM
IBM provides IT services and consulting to a global client base. The company develops technology solutions across areas such as cloud computing, security, analytics, and infrastructure. It operates as a public organization with more than 10,001 employees. The corporate headquarters are located in Armonk, New York.
How to get in at IBM
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