About the role#
The 3D Heterogeneous Integration Development Intern will contribute to advanced packaging and process-integration development. This includes work on wafer-to-wafer and die-to-wafer hybrid bonding, through-silicon via (TSV) or through-oxide via (TOV) technologies, and interposers. You will work alongside engineering teams to conduct experiments, analyze technical data, and support daily integration tasks.
What you'll do#
- Plan and perform design of experiments (DOEs) using internal semiconductor tooling and equipment at external partners.
- Analyze and interpret engineering data from experiments, process optimizations, and characterization activities.
- Develop or support process models to improve the understanding of advanced packaging and integration performance.
- Assist engineers with daily integration, process development, documentation, and technical problem-solving.
- Collaborate with process, materials, equipment, and characterization teams to support project objectives.
- Summarize experimental results and communicate technical findings and recommended next steps to stakeholders.
- Perform all activities in a safe manner and support all Environmental, Health, Safety, and Security requirements.
What you'll need#
- Current enrollment as at least a sophomore pursuing a Bachelor’s, Master’s, or PhD in Electrical, Mechanical, or Chemical Engineering, Materials Science, or a related field.
- A minimum 3.0 overall GPA and good academic standing.
- English fluency in both written and verbal communication.
- Ability to work at least 40 hours per week.
- Preferred experience includes prior internships, leadership roles, or project management skills.
- Interest in using AI tools and emerging technologies to streamline workflows is an asset.
- Preferred technical background includes experience with advanced semiconductor packaging, hybrid bonding, TSV/TOV, interposers, or data analysis.
- Availability for a six-month co-op assignment is preferred.
Location & details#
- Location: Malta, New York, United States.
- Term: Summer 2027.
- Work Modality: On-site.
- Employment Type: Full-time.
- This position is paid.
About GlobalFoundries
GlobalFoundries manufactures semiconductors for various industries including automotive, aerospace, and data centers. The company operates manufacturing facilities across the United States, Europe, and Asia. It was founded in 2009 and currently functions as a public company. The organization employs over 10,000 people.
How to get in at GlobalFoundries
Applying early to GlobalFoundries gives you a distinct advantage because recruiters review applications as they arrive. Intern Insider sends an instant alert the moment a role matching your target is published anywhere, so you apply among the first and get seen before the pile grows. Reaching out to the right person often beats waiting in an automated queue. Intern Insider surfaces the recruiters behind the company roles so you can reach out directly to ask about the role or a referral, which materially improves your response rates.
