Intern, Thermal Modeling & Simulation Engineer (AI Memory / HBM)

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    Samsung Semiconductor

    10,001+ employeesSan Jose, California, United StatesSemiconductor Manufacturing
    Actively hiringPaidSemiconductor Manufacturing
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    Best applied by Oct 28

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    About the role#

    Samsung Semiconductor is seeking a thermal engineering intern to join the Power & Thermal Lab. You will work on building and calibrating models for HBM stacks and packages to support the development of next-generation AI memory technologies. This role involves direct ownership of specific platform components, ranging from physics-based CFD references to validated models that inform design decisions for architecture, power, and package teams.

    What you'll do#

    • Build and calibrate CFD models (Simcenter Flotherm) of HBM stacks and packages under realistic cooling conditions.
    • Extend compact thermal models to new stack heights, die configurations, and base-die power levels.
    • Quantify model accuracy against CFD results in both steady state and transient conditions.
    • Develop homogenization methods to replace fine features, such as TSV arrays and micro-bumps, with effective properties.
    • Improve thermal solver speeds using model-order reduction, sparse linear algebra, preconditioning, GPU acceleration, or machine-learning surrogates.
    • Run transient simulations using real AI workload traces to identify spatiotemporal hotspots and explore thermal-aware policies.
    • Evaluate advanced cooling options and thermal-interface materials, translating findings into design guidance.
    • Couple thermal models with the lab's trace-driven power simulation engine.
    • Document methods and results for presentation to engineers and lab leadership.

    What you'll need#

    • Currently pursuing a PhD (preferred) or Master's degree in Mechanical Engineering, Materials Science, Electrical Engineering, Applied Physics, or a related field.
    • At least one academic quarter or semester remaining in your program.
    • A strong foundation in heat transfer, specifically transient conduction in multi-layer solids and thermal contact resistance.
    • Hands-on experience with numerical methods, such as finite-volume, finite-element, or finite-difference.
    • Proficiency in scientific programming using Python or MATLAB.
    • Ability to critically evaluate simulation results, including mesh convergence and energy balance, and explain discrepancies between models.
    • Experience with Simcenter Flotherm, Ansys Icepak/Fluent, or COMSOL is preferred.
    • Familiarity with compact or reduced-order thermal models, ML surrogates, electronics packaging, 3D-IC thermal management, HPC, or GPU programming is a plus.

    Location & details#

    • Location: San Jose, California.
    • Modality: On-site.
    • Employment type: Full-time internship.
    • Compensation: Paid position.

    About Samsung Semiconductor

    Samsung Semiconductor operates as a subsidiary of Samsung Electronics. The company manufactures semiconductor components for device makers. It started operations in 1974. The organization employs more than 10,000 people.

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