About the role#
Qorvo is hiring a Packaging Engineering Intern to join our Global Operations group. This role provides hands-on experience in semiconductor assembly and substrate technology. You will work on real projects that support our manufacturing processes and technology development.
What you'll do#
- Learn methodologies for Advanced Packaging and Substrate Technology Development.
- Study substrate design rules and manufacturing processes.
- Review assembly and marking diagrams to identify improvement opportunities.
- Plan and execute Design of Experiments to support project deployment.
- Participate in onsite, hands-on learning regarding semiconductor assembly processes.
- Assist with documentation and continuous improvement activities.
What you'll need#
- A Bachelor of Science degree in Materials Science, Chemical Engineering, Mechanical Engineering, or Electrical Engineering.
- A GPA of 3.0 or higher.
- Strong analytical thinking skills and the ability to drive problem resolution.
- Good communication and presentation skills.
- Knowledge of packaging materials like solder, epoxy, flux, or mold compounds.
- Familiarity with assembly processes such as Wire Bond, Die Attach, or Flip Chip.
- Experience with PCG design software like Altium or KiCAD.
Location & details#
- This position is located in Greensboro, North Carolina.
- This is an on-site, full-time internship.
- This role does not offer visa sponsorship.
About Qorvo, Inc.
Qorvo, Inc. operates in the semiconductor manufacturing sector. The company produces components such as power amplifiers, filters, and antenna control solutions. It serves clients in the automotive, defense, aerospace, and mobile markets. The organization maintains a workforce of between 5,001 and 10,000 employees.
How to get in at Qorvo, Inc.
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