Intern - Advanced Packaging TD

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    Micron Technology

    We're accelerating the transformation of information to intelligence.

    10,001+ employeesFounded 1978Boise, IdahoSemiconductor Manufacturing
    Actively hiringPaidSemiconductor Manufacturing
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    Best applied by Nov 18

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    About the role#

    Join the Advanced Packaging Technology Development team to work on next-generation interconnect technologies. You will collaborate with engineers to support the development of hybrid bonding, micro bump technology, Through-Silicon Vias, and thermal management solutions. This role focuses on improving semiconductor performance and reliability through hands-on process optimization and data analysis.

    What you'll do#

    • Lead structured problem-solving activities using Kepner-Tregoe methodologies to address process and yield challenges.
    • Define, execute, and analyze Design of Experiments for advanced packaging and interconnect processes.
    • Analyze process, line-monitoring, and yield data to develop new metrics for process optimization.
    • Present technical findings and work with engineering teams across different sites and functional areas.
    • Apply AI and Code Assist to build Agent-based solutions that improve engineering workflows and data analysis.

    What you'll need#

    • Current enrollment in a Master’s or PhD program in a semiconductor-related field, with an expected graduation between Fall 2027 and Summer 2028.
    • Experience with data extraction, statistical analysis, and technical reporting using JMP or similar tools.
    • Ability to manage multiple technical projects and adapt to changing responsibilities within project timelines.
    • Experience using AI, Code Assist, or Agent-based solutions for technical applications.
    • Academic or research experience in advanced semiconductor packaging, interconnect technologies, or package thermal management.
    • Familiarity with semiconductor process technologies such as BEOL, hybrid bonding, or TSV.
    • Experience with structured problem-solving methodologies like Kepner-Tregoe.

    Location & details#

    • This internship is located in Boise, Idaho.
    • The role is on-site and full-time.
    • This is a paid internship position.

    About Micron Technology

    Micron Technology produces memory and storage solutions including DRAM, NAND, and NOR products. The company operates as a public organization with over 43,000 employees. Founded in 1978, it maintains its headquarters in Boise, Idaho. Micron serves various markets ranging from data centers to mobile devices.

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