Intern - ADV DRAM Process Integration Engineer

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    Micron Technology

    We're accelerating the transformation of information to intelligence.

    10,001+ employeesFounded 1978Boise, IdahoSemiconductor Manufacturing
    Actively hiringPaidrollingSemiconductor Manufacturing
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    Best applied by Sep 26

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    About the role#

    As a process integration engineer in the 3D DRAM organization, you will work in a 300mm R&D facility. You will focus on the performance and manufacturability of next-generation memory technology. This role involves working on device components like charge storage devices and thin-film transistors.

    What you'll do#

    • Contribute to technology development for next-generation DRAM.
    • Optimize process flows and develop solutions to meet product requirements.
    • Design and run experiments in the R&D fab.
    • Analyze inline, parametric, and probe data to evaluate performance and failure mechanisms.
    • Engage with cross-functional teams including process development and product engineering.

    What you'll need#

    • Currently pursuing a PhD in Materials Science, Electrical Engineering, Physics, or Chemical Engineering.
    • Must be a current student and cannot graduate prior to September 2027.
    • Experience with semiconductor device fabrication.
    • Knowledge of electrical and material characterization.

    Location & details#

    • Location: Boise, Idaho, United States.
    • Modality: On-site.
    • Employment: Full-time internship.
    • Compensation: Paid position.

    About Micron Technology

    Micron Technology produces memory and storage solutions including DRAM, NAND, and NOR products. The company operates as a public organization with over 43,000 employees. Founded in 1978, it maintains its headquarters in Boise, Idaho. Micron serves various markets ranging from data centers to mobile devices.

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