About the role#
This is a full-time, paid internship for Summer 2027 based in Santa Clara, California. You will work on-site as part of our software engineering team to support the development of semiconductor equipment.
What you'll do#
- Design, prototype, and build software solutions for semiconductor equipment components and devices.
- Create software documentation and test procedures.
- Troubleshoot software problems of limited difficulty.
- Communicate with internal customers to understand project requirements.
What you'll need#
- Current enrollment in a Bachelor's degree program in Computer Science, Computer Engineering, Cybersecurity, Mathematics, or a related field.
- Proficiency in C, C++.Net, and C#.
- Familiarity with basic software engineering theories and concepts.
- 1-2 years of related experience.
Location & details#
- Location: Santa Clara, California.
- Modality: On-site.
- Term: Summer 2027.
- Employment: Full-time internship.
About Applied Materials
Applied Materials operates in the semiconductor manufacturing industry. The company produces equipment for materials engineering and flat panel display manufacturing. It was founded in 1967 and maintains its headquarters in Santa Clara, California. The organization employs over 32,000 people.
How to get in at Applied Materials
Applying early gives you a distinct advantage at Applied Materials, as recruiters often review candidates before the applicant pool becomes unmanageable. Intern Insider sends an instant alert the moment a role matching your target is published anywhere, ensuring you can submit your materials among the first. This helps you avoid the frustration of applying to a role that has already been filled or overlooked. You can also improve your response rates by reaching out to the people actually hiring for the team. Intern Insider surfaces the recruiters behind the company roles so you can contact them directly to ask about the position or a referral. Making that personal connection often helps your application stand out from the pile.
