Research Scientist - Semiconductor Process Chemistry - Co-op Student Fall 2026
TechInsights · Ontario, Canada
Create a free account to unlock the application link.
Apply NowAbout the role#
This co-op position offers the opportunity to contribute to research and development at the intersection of chemistry and materials science. You will join the R&D team to work on chemical and plasma etching of advanced semiconductor materials. You will have ownership over your experiments, from design through execution, while working in a collaborative environment.
What you'll do#
- Research, design, and execute experiments on chemical (wet) and plasma (dry) etching of modern semiconductor materials.
- Investigate open-ended technical challenges involving chemical interactions, process development, and materials compatibility.
- Translate experimental process concepts into reliable and repeatable laboratory workflows.
- Document experimental methods, results, and technical insights to support ongoing research and future process development.
What you'll need#
- Currently enrolled as a student in Chemistry, Chemical Engineering, Materials Science, or a related field with an emphasis on experimental chemistry.
- Strong foundation in chemistry principles, including reaction mechanisms, surface chemistry, and kinetics.
- Extensive hands-on chemistry lab experience, including independent experimental setup, execution, troubleshooting, and documentation.
- Ability to leverage AI-assisted tools, scientific literature, and technical resources to support research and problem-solving.
- Experience with semiconductor etching, microfabrication, vacuum systems, or surface analysis techniques (such as AFM, SEM, or SIMS) is an asset.
Location & details#
- This is an on-site position based in Ottawa, Ontario, Canada.
- Term: Fall 2026.
- This is a paid, full-time co-op role.
- Candidates will be required to submit citizenship or permanent residency information to comply with export control regulations.
Know someone who'd be a fit? Pass it along.




