About the role#
As an Advanced Package TD Process Integration Intern, you will work with engineers to develop interconnect technologies. This role involves hands-on work in experimental design, line monitoring, and data analysis to support yield improvement and process optimization.
What you'll do#
- Lead problem-solving activities using structured methods like Kepner-Tregoe.
- Define and run Design of Experiments for process development.
- Conduct experimental work using internal systems and document your results.
- Analyze data to provide clear, actionable recommendations.
- Develop new line monitoring methods and define critical metrics.
- Support line monitoring through project management and yield improvement initiatives.
- Communicate findings to local and global teams.
- Use AI tools and workflows to maximize learning.
What you'll need#
- Current enrollment in a Bachelor's or Master's degree program, with a graduation date no earlier than Fall 2027.
- Strong skills in data extraction, analysis, and reporting using tools like JMP or system analytics.
- Ability to handle multiple tasks and adapt to changing responsibilities.
- Capacity to work well with multi-functional teams.
- Tenacity to work under tight timelines and limited resources.
- Initiative and flexibility to take on added work.
- Experience with semiconductor process integration or packaging is preferred.
- Familiarity with structured problem-solving frameworks and experimental design is a plus.
Location & details#
- Location: Boise, Idaho.
- Work modality: On-site.
- Employment type: Full-time.
- Compensation: Paid internship.
About Micron Technology
Micron Technology produces memory and storage solutions including DRAM, NAND, and NOR products. The company operates as a public organization with over 43,000 employees. Founded in 1978, it maintains its headquarters in Boise, Idaho. Micron serves various markets ranging from data centers to mobile devices.
How to get in at Micron Technology
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