About the role#
The Memory Systems Architecture team defines the next generation of High Bandwidth Memory (HBM) solutions for artificial intelligence, high-performance computing, and data center applications. As an intern, you will contribute to the architecture and microarchitecture development of future HBM products. You will work with experienced architects to evaluate new memory features, analyze architectural trade-offs, and develop performance models. Your work will help improve memory performance, reliability, and efficiency for modern computing workloads.
What you'll do#
- Research and evaluate next-generation HBM architecture features, including memory scheduling, refresh management, thermal behavior, and controller interactions.
- Develop and enhance performance models, simulators, and analytical tools using Python, C++, or similar technologies.
- Analyze workload behavior, simulation results, and architectural data to provide recommendations for product development.
- Use AI-assisted engineering tools to accelerate software development, data exploration, and technical documentation.
- Collaborate with architecture, design, and memory controller teams to support feature definition, design reviews, and specifications.
What you'll need#
- Currently pursuing a Bachelor's, Master's, or PhD in Electrical Engineering, Computer Engineering, Computer Science, or a related field.
- 0-2 years of relevant experience through internships, research, academic projects, or coursework.
- Coursework or project experience in computer architecture, memory hierarchies, DRAM technologies, interconnects, or hardware system design.
- Programming experience with Python and at least one of the following: C++, SystemVerilog, or similar engineering languages.
- Ability to read and interpret technical specifications, datasheets, or hardware interface definitions.
- Experience using AI coding assistants and large language models as part of engineering workflows.
- Strong analytical, problem-solving, and communication skills.
- Familiarity with memory simulation environments like Ramulator, DRAMSim, or gem5 is preferred.
- Knowledge of HBM, DDR, LPDDR, GDDR, or memory reliability concepts like ECC and RAS features is a plus.
Location & details#
- This is a full-time, on-site internship based in Folsom, California.
- The position is paid at a rate of $50.24 per hour.
About Micron Technology
Micron Technology produces memory and storage solutions including DRAM, NAND, and NOR products. The company operates as a public organization with over 43,000 employees. Founded in 1978, it maintains its headquarters in Boise, Idaho. Micron serves various markets ranging from data centers to mobile devices.
How to get in at Micron Technology
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