Package Architect

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MediaTek

10,001+ employeesFounded 1997Hsin-ChuSemiconductor Manufacturing
Actively hiringPaidSemiconductor Manufacturing
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Best applied by Nov 12

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About the role#

This is a full-time, paid internship for a Package Architect. You will join the Data Center Product Architecture and Technology team to support the development of next-generation silicon products. This role is a rolling opportunity.

What you'll do#

  • Develop and evaluate packaging solutions for data center and AI silicon products.
  • Perform signal and power integrity analysis for high-speed interfaces.
  • Design and analyze power delivery networks for next-generation XPUs.
  • Work with cross-functional teams to improve packaging solutions, focusing on performance and form factor.
  • Monitor industry and technology trends.

What you'll need#

  • Currently pursuing a Master's or Ph.D. in Electrical Engineering, Computer Engineering, or a related field.
  • Expected graduation date between December 2027 and December 2028.
  • Understanding of VLSI package design and silicon interactions.
  • Experience with transient and frequency domain analysis.
  • Knowledge of silicon packaging and deep submicron silicon processes.
  • Proficiency with Cadence Allegro for package layout and Ansys HFSS for SI/PI analysis.
  • Ability to work independently and manage a variety of technical tasks.
  • Good communication and interpersonal skills.

Location & details#

  • Location: On-site in San Jose, California or Portland, Oregon.
  • Employment type: Full-time.
  • Sponsorship: Not provided.

About MediaTek

MediaTek is a fabless semiconductor company founded in 1997. Based in Hsin-Chu, the firm develops systems-on-chip for mobile, home entertainment, and IoT products. Its technology powers devices including smartphones, tablets, and wearables. The company employs over 10,000 people and operates as a public entity.

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