About the role#
This internship is part of the Sabre 3D process development and engineering team. You will work on advancing electrodeposition technology for wafer fab equipment. The team focuses on areas like advanced packaging, through-silicon and through-glass vias, panel-level plating, and grain engineering.
What you'll do#
- Apply engineering and electrodeposition methodologies to enhance equipment and reactor performance on the Lam SABRE 3D system.
- Test and characterize new or modified process formulations.
- Set up and run bench-scale experiments.
- Operate application lab deposition tools and use metrology equipment to measure wafer performance.
- Conduct chemistry and material analysis.
- Compile data and perform research using scientific journals.
What you'll need#
- Current enrollment in a Master's or PhD program in Chemical Engineering, Chemistry, Mechanical Engineering, or Material Science.
- Hands-on experience working in a wet laboratory.
- Knowledge of electrochemistry, specifically regarding copper, tin, tin-alloys, or nickel electrodeposition.
- Experience with modeling and simulation techniques such as transport phenomena or electrochemical kinetics.
- Understanding of grain growth mechanisms and microstructure evolution in plated films.
- Experience troubleshooting complex equipment and systems.
Location & details#
- Location: Tualatin, Oregon.
- This is a paid, full-time, hybrid internship.
- The role follows a rolling schedule.
How to get in at Lam Research
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