Module Engineering - PhD Intern (Advanced Wet Etch and Cleans)

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    Intel Corporation

    10,001+ employeesSanta Clara, CaliforniaSemiconductor Manufacturing
    Actively hiringPaidrollingSemiconductor Manufacturing
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    Best applied by Oct 27

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    About the role#

    As a PhD intern in Module Engineering, you will contribute to the development and optimization of semiconductor manufacturing processes. You will work on sustaining and improving equipment performance, troubleshooting technical issues, and supporting qualification activities to meet production standards. This role provides an opportunity to apply academic research to engineering challenges and gain hands-on experience in a manufacturing environment.

    What you'll do#

    • Support the development and optimization of manufacturing processes for a specific module.
    • Sustain and improve equipment performance to ensure reliability and efficiency.
    • Troubleshoot equipment issues and perform qualification activities.
    • Collaborate with engineering teams to refine process control methodologies.
    • Apply statistical analysis and experimental design to improve process reliability and throughput.
    • Use materials and device characterization techniques, such as SEM and TEM.
    • Contribute to continuous improvement initiatives for process control systems.

    What you'll need#

    • Current enrollment in a PhD program for Materials Science Engineering, Physics, Chemistry, Electrochemistry, or Chemical Engineering.
    • At least 3 months of experience through research, laboratory work, internships, or industry roles.
    • Demonstrated hands-on experience via academic research, coursework, or technical projects.
    • A basic understanding of semiconductor manufacturing, process integration, or advanced manufacturing methodologies.
    • Deep expertise in areas such as chemical reaction kinetics, selective wet etching, interfacial surface chemistry, corrosion or passivation mechanisms, and surfactant-assisted cleaning or drying.
    • Experience with advanced thin-film and surface characterization techniques, including ellipsometry, AFM, XPS, contact angle goniometry, FTIR, TXRF, or ICP-MS.
    • Skills in automated fluidic systems, wet processing instrumentation design, single-wafer spin hardware, or experimental fluid dynamics.
    • Proficiency in Python, MATLAB, JMP, or Machine Learning for design of experiments, multivariate statistical analysis, or process automation.
    • A strong record of publications, conference presentations, or patent applications.
    • A cumulative GPA of 3.0 or higher is preferred.

    Location & details#

    • Location: Hillsboro, Oregon, United States.
    • Work modality: On-site.
    • Employment type: Full-time internship.

    About Intel Corporation

    Intel Corporation designs and manufactures semiconductors. The company focuses on artificial intelligence, autonomous driving, and non-volatile memory solutions. It operates as a public company with over 110,000 employees. The headquarters are in Santa Clara, California, with major office locations across the United States, Israel, France, Singapore, and Poland.

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